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Enhancement of Yield for Single-Sided Dual-Contact Flexible Printed Circuits

When single-sided double-contact FPC electrodes exceed 3.0 mm in length and are less than 0.3 mm in width, they are prone to deformation during manufacturing, leading to low yield rates, which can be significantly improved through strategic process enhancements, including proper support selection and optimized processing conditions.

Enhancement of Yield for Single-Sided Dual-Contact Flexible Printed Circuits Read More »

Initial Inspection Process for PCBA Manufacturing

The first article inspection in PCBA processing is crucial for ensuring product quality by inspecting and testing the initial piece to identify potential issues early, thus preventing defects and economic losses during production.

Initial Inspection Process for PCBA Manufacturing Read More »

How much does the PCB duplication service cost? PCB duplication processing details.

The cost of a PCB copy board varies based on size, layer count, component density, and operational complexity, with larger boards and those with more layers and solder joints typically being more expensive to copy.

How much does the PCB duplication service cost? PCB duplication processing details. Read More »

Methods for Standardizing Technical Requirements in PCB Design.

The PCB production process involves multiple steps and specific adjustments to layout, line width, hole sizes, and tolerances to meet design and manufacturing standards while ensuring reliability and efficiency.

Methods for Standardizing Technical Requirements in PCB Design. Read More »

Development of PCBA Modules for Internet of Things Applications

The research and development of PCBA modules hinges on hardware and software design, emphasizing the importance of program selection, schematic and layout design, PCB manufacturing, and testing, with critical focus on functionality, cost, and stability.

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Multi-layer printed circuit boards and single-layer printed circuit boards.

Printed circuit boards (PCBs) are classified into three types—single-sided, double-sided, and multi-layer—based on the number of conductive layers, with single-sided boards being simple and cost-effective, double-sided boards providing enhanced connectivity, and multi-layer boards offering advanced capabilities for complex electronic applications.

Multi-layer printed circuit boards and single-layer printed circuit boards. Read More »

What are the primary factors influencing PCB pricing?

The cost of PCB manufacturing varies based on plate materials, board thickness, copper and dielectric layer thickness, raw material suppliers, process standards, and surface treatments, with customizations and process complexities affecting overall pricing.

What are the primary factors influencing PCB pricing? Read More »

SMT (Surface-Mount Technology) chip assembly process?

SMT patch processing involves applying advanced surface mount technology to PCBs for high-density, compact, and cost-effective electronic assembly, utilizing techniques such as solder paste printing, component placement, and reflow soldering, while addressing the need for miniaturization and high production efficiency.

SMT (Surface-Mount Technology) chip assembly process? Read More »

Strategies to Enhance SMT Assembly Efficiency

To maintain a competitive edge in the increasingly fierce PCB assembly market, plants should focus on reducing production costs by enhancing production efficiency, primarily through optimizing placement procedures and balancing equipment loads on the SMT production line.

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Strategies to Enhance Component Quality and Efficiency

The key points are: configure air source pressure above 7 kg/cm², ensure proper exhaust and ventilation, maintain a workshop temperature of 23±3°C and humidity between 45-70%, use anti-static measures, refrigerate solder paste, replace worn parts regularly, and monitor furnace temperature for optimal soldering.

Strategies to Enhance Component Quality and Efficiency Read More »

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