The characteristic impedance of a PCB transmission line must match the electronic impedance of the driver and receiver to prevent signal distortion, and controlling impedance requires careful attention to factors such as trace width, material properties, and layer stack-up.
Why is it important to match the Driver and Receiver in PCB design? Read More »
Impedance continuity is essential in PCB design, but when it’s disrupted by factors like sharp corners, large pads, vias, or through-hole connectors, strategies such as chamfering, dielectric adjustments, and optimized via designs can help mitigate signal reflections and ensure signal integrity.
Methods to Address Impedance Discontinuities in PCB Design Read More »
Advancements in technology have elevated the importance of precise impedance control in PCB design, due to higher speed and density requirements, necessitating accurate impedance calculations and impedance matching to reduce distortion, interference, and EMI.
Designing PCB Impedance at the System’s Input Stage Read More »
In high-speed PCB design, copper coating in blank areas is typically used for grounding, and the distribution between grounding and power supply should minimize impedance effects and signal integrity issues, with test point placement often requiring manual adjustments based on density and test specifications.
Highly practical design for high-frequency PCB circuits Read More »
Changes in dielectric thickness directly impact characteristic impedance, making it a crucial factor in managing impedance during production, especially in high-frequency circuits, necessitating meticulous control within a 10% margin to achieve desired values.
High-Freq PCB Processing Impact on Impedance Control & Solutions Part 3 Read More »
The article discusses the importance of characteristic impedance control in printed circuit boards, particularly focusing on the surface microstrip structure commonly used in practice, highlighting its relationship with substrate material selection.
Influence of High-Frequency PCB Processing on Impedance Control: Part 1 – Solutions Read More »
Material selection in PCBA assembly is crucial for board performance and reliability. Considerations such as solder type, PCB substrate material, and packaging materials must be carefully chosen based on factors like environmental impact, temperature requirements, signal integrity, and heat dissipation to ensure optimal performance and sustainability. Working closely with manufacturers and suppliers is essential in making informed choices for specific applications.
Selecting Materials for PCB Assembly, Soldering, and Packaging in PCBA Read More »
Maintaining continuous impedance in PCB design is important, but if there are occasions when the impedance cannot be continuous, factors such as gradient lines, corners, large pads, vias, and through-hole coaxial connectors can be managed to reduce impedance discontinuities.
A transmission line is a signal line with a signal return, typically a trace on a PCB, and its length and the propagation speed of the signal determine whether it functions as a transmission line with its characteristic impedance affecting signal integrity.
How long is the trace of the transmission line on the PCB board? Read More »
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