Advancements in technology have led to shrinking circuit boards, creating challenges in accommodating numerous electronic components while maintaining adequate space for test points. Needle beds for circuit testing have inherent limitations, such as probe diameter constraints and spacing issues due to soldering requirements. Placement of needles near tall components can lead to collisions and damage, posing difficulties in accommodating test points for diverse components on PCBs. Discussions about reducing test points intensify as boards shrink, with alternative testing techniques emerging but not yet comprehensively replacing ICT. Manufacturers’ consultation regarding minimum test point diameter and distance constraints is crucial to ensure ICT needle implantation capabilities. Large-scale manufacturers may also impose constraints on the maximum distance between test points to prevent fixture damage.