CNC drilling

Creating 8-layer PCBs: Expert tips and techniques

The high-precision eight-layer printed circuit board goes through a complex production process, including drilling, plating, etching, and layer routing, to create via holes, blind holes, and buried vias for increased wiring space and optimal signal routing.

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Double-sided FPC: Machining & Technics Standards for Shape & Hole.

Emerging FPC technologies, including chemical etching, enhance accuracy and efficiency, while guide holes improve alignment, predominantly through copper foil markings. Punching and milling methods offer versatility and cost-effectiveness, with CNC milling aiding rapid prototyping despite longer setup times. Integrated adjustment processing is optimal for low-volume, high-value products.

Double-sided FPC: Machining & Technics Standards for Shape & Hole. Read More »

Multilayer PCB Manufacturing Process – Part 2

Press the pre-designed positioning system for CNC drilling, etch and de-drill hole walls, then proceed to the unique steps of inner layer imaging, blackening, lamination, etch back, and de-drilling for multi-layer boards, which demand stricter quality requirements and specialized processes, including glycerin hot-melt, for elevated reliability and complexity compared to double-sided boards, reflecting the evolution towards high-speed, multi-functionality, and increased capacity in electronic technology, championed by WellCircuits Limited.

Multilayer PCB Manufacturing Process – Part 2 Read More »

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