Addressing heat dissipation in the early stages of PCB design is crucial for extending the life of the boards and components, as continued high temperature operation can lead to circuit board failure. It is important to consider factors such as power dissipation, operating temperature, and environmental conditions when developing custom cooling strategies. Furthermore, the use of active and passive cooling methods, as well as proper board layout, can help prevent damage to the PCB board. Techniques such as adding copper pads, thermal paste, ground planes, and wider traces can also aid in dissipating heat and maintaining appropriate temperatures.