The main purpose of lead forming in integrated circuits is to facilitate soldering to PCB pads and mitigate environmental stresses like vibration and temperature variations, crucial for ensuring product reliability and solder joint integrity during operational testing.
Lead Forming Process for PCBA Integrated Circuits Read More »
The opening of FR4 PCB BGA welding can be caused by factors such as insufficient solder paste, poor solderability, poor coplanarity, mounting misalignment, thermal mismatch, and exhaust through the solder mask, with various effects described. Measures to address BGA weld opening include ensuring sufficient solder paste, improving the weldability of fr4 pcb pads, maintaining coplanarity of the fr4 pcb substrate, precisely mounting elements, avoiding excessive temperature gradients, covering through holes before wave soldering, and pre-drying elements.
The issue of open welding in FR4 PCB BGA soldering and its solution Read More »
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