FPC manufacturers should carefully choose surface treatments for soft boards based on performance needs, as each method—OSP, Immersion Silver, Tin Plating, Immersion Gold, Gold Plating, and Nickel-Palladium-Gold—has its own advantages and disadvantages affecting soldering, storage, and production processes.
Regarding the Various Surface Treatments for Flexible Printed Circuit (FPC) Boards Read More »
The standard for PCBA board inspection in the SMT patch workshop includes a comprehensive list of criteria such as checking for solder joint issues, correct component placement, and cleanliness of the PCB.
Standard for Inspection of SMT Patch PCBA Boards Read More »
SMT chip processing imposes specific PCB design requirements regarding shape, size, thickness, positioning holes, process edges, and fiducial marks to optimize efficiency in PCBA processing.
Requirements for PCB Design in SMT Chip Processing Read More »
The fundamental principles of PCBA design for manufacturability emphasize optimizing surface mount and crimping components, considering package size and pin pitch, shortening process paths, optimizing component layout, harmonizing pad designs, focusing on new packaging, prioritizing sensitive components, and continuously refining design rules based on production experiences.
Fundamental Principles of PCBA Design for Manufacturability Read More »
The main control IC troubleshooting process involves checking power supply voltage, assessing the crystal oscillator’s functionality, verifying input/output signals, inspecting solder joints, and considering PCB design issues as potential causes of failure, rather than immediately replacing the IC.
How can one assess issues related to the main control IC on the PCBA? Read More »
The article discusses the characteristics, advantages, and materials of FPC connectors, highlighting their compact size, diverse applications, and the significance of materials like copper foil and polyimide in their performance and longevity.
Characteristics, materials, and lifespan of FPC connectors. Read More »
When designing PCB schematics, decisions about component packaging and pad patterns must consider mechanical dimensions and electrical connections, as well as any installation limitations on the PCB layers. What specific aspect would you like to delve into further?
PCB design takes into account the selection of component packaging. Read More »
The increasing waste from printed circuit boards (PCBs) poses serious environmental and health risks due to hazardous materials, but various recycling technologies, including physical, chemical, and biotechnological methods, offer opportunities for effective recovery of valuable metals and materials, emphasizing the need for advancements in e-waste management.
Investigate the disposal techniques for discarded PCB circuit boards. Read More »
As HDI boards advance with high-integration ICs and assembly technology, PCB manufacturing faces challenges in meeting quality and delivery demands due to intricate designs and SMD definition complexities.
Single-sided PCB prototypes are produced rapidly. Read More »
The article outlines common issues in recognition systems, positioning, vacuum operations, programming, incoming materials, and feeders that lead to PCBA rejection, along with countermeasures to improve production efficiency and quality control.
PCBA Processing: Causes and Solutions for Material Discarding Read More »
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