copper foil adhesion

What are the causes of copper delamination in PCB circuit boards?

In PCB production, copper rejection—poor adhesion of copper wires—can arise from manufacturing process issues, laminate manufacturing flaws, or incompatible raw materials, all negatively affecting product quality.

What are the causes of copper delamination in PCB circuit boards? Read More »

Analysis and Optimization of Burst Plates in PCB Reflow Soldering

This document analyzes PCB board burst phenomena during reflow soldering, detailing the impact of moisture absorption, poor adhesion, inappropriate reflow temperatures, and design flaws, while suggesting improvements for enhanced soldering reliability.

Analysis and Optimization of Burst Plates in PCB Reflow Soldering Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)