Copper Foil

Influential Factors on Etching Solution Characteristics in PCB Fabrication

The selection of an appropriate etching solution is crucial for high-density thin wire image quality in PCB manufacturing, considering physical, chemical, and mechanical factors such as concentration, composition, temperature, foil thickness, circuit geometry, equipment type, spray technology, distance and pressure, surface tension, and viscosity.

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Overview of Ten Primary Deficiencies in the PCB Board Design Process

Clear information in PCB board design is crucial to avoid misunderstandings; this article identifies ten major defects, including undefined processing levels, proximity of copper foil to the outer frame, filler block usage, patterned ground layers, random characters, short SMD pads, single-sided pad settings, hole overlap, excessive filling blocks, and misuse of graphic layers, all aiming to enhance production efficiency and minimize errors.

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Three Types of Guide Holes for PCB Prototyping

Circuit boards are made up of layers of copper foil circuits connected by vias, including Plating Through Holes (PTH), Blind Via Holes (BVH), and Buried Via Holes (BVH), with different methods and costs for conducting electricity and maximizing space utilization in PCB prototyping.

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Enhancing PCB Heat Dissipation: A Professional Approach

Effective heat dissipation treatments on PCBs, such as incorporating heat-dissipating copper foil, utilizing thermal vias, exposing copper on the back of IC, and careful PCB layout considerations, are crucial for preventing overheating and ensuring optimal performance of electronic equipment.

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The Distinction Between the Positive and Negative Impedance of a Circuit Board

The negative film of impedance boards uses acid etching and preserves the required circuit, while the positive film uses alkaline etching and removes tin-lead protection to reveal the circuit.

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An Overview of PCB Industry Chain Analysis

Printed circuit boards (PCBs) are essential substrates for assembling electronic parts, connecting points, and components on a common base material. They play a crucial role in forming circuit connections and transmitting signals in electronic products, making them the key electronic interconnection in the industry. The PCB industry reflects the development speed and technical level of the electronics industry in a country or region. Fiberglass cloth, copper foil, and copper clad laminate are important raw materials for PCB production, with the copper foil prices influencing the overall cost of PCBs. The CCL and PCB industries require substantial capital investment and possess significant bargaining power in the market. High-end PCB segments like HDI demand advanced management and technological capabilities, while outsourcing services are prevalent for low-end products.

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Analysis of Common Problems in Circuit Boards

The thickness of the copper foil affects the thermal conductivity of the aluminum substrate, vias are used to connect electrical signals, soldering iron temperature is 200~300 degrees, unfilmed aluminum substrate can be easily scratched, LED lamp beads are soldered with a heating table, “is” on the circuit board is a stand-alone centrifugal switch mode, R+ is right channel positive output, L+ is left channel positive output, various processes for circuit boards, main switch board is generally a four-layer board, laminating process for multilayer pcb circuit boards involves prepreg bonding. WellCircuits Limited specializes in high-precision circuit board manufacturing.

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Etching Procedure for the External Circuitry of PCB 1

Pattern plating method and full board copper plating process are commonly used in current PCB processing, with ammonia-based etchants widely used for etching, copper separation, and equipment adjustments crucial for high-quality results.

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Cleaning Method for PCB Substrate Surface 1

Surface quality of copper foil is critical for successful image transfer process; thorough cleaning methods, such as chemical cleaning and vapor degreasing, are essential to remove contaminants and ensure reliable usage in printed circuit board fabrication.

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Cleaning Method for PCB Substrate Surface 1

Surface quality of copper foil is critical for successful image transfer process; thorough cleaning methods, such as chemical cleaning and vapor degreasing, are essential to remove contaminants and ensure reliable usage in printed circuit board fabrication.

Cleaning Method for PCB Substrate Surface 1 Read More »

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