The PCB additive process, driven by the Internet era’s efficiency and environmental sustainability, offers advantages such as cost reduction, faster production, and high-precision manufacturing through techniques like full, semi, and partial additive methods for creating conductive patterns on printed circuit boards.
The PCB production process involves several critical steps, including material cutting, inner layer creation, pressing, drilling, copper plating, outer layer production, and protective coating, ultimately culminating in functional testing and packaging, reflecting the industry’s advancements and demands, especially for 5G applications.
Overview of the 12-Step Fundamental Process Flow in PCB Manufacturing Read More »
PCB boards have evolved from the development of copper plating on borehole walls in the 1950s, to the use of multilayer and flexible PCBs, driving the dynamic growth of the industry.
Copper plating on PCBs serves multifaceted purposes: reducing impedance, enhancing anti-interference capabilities, minimizing voltage drop, and improving power supply efficiency, especially when segregating digital and analog grounds. Challenges arise in addressing single-point connections, dealing with high-frequency emission sources, and managing isolated islands. Choosing between large-area and grid copper pour depends on the circuit’s needs, while in digital circuits, copper coating reduces ground plane impedance, and in mixed circuits, careful ground routing and power supply placement are essential.
The common process for processing printed circuit boards utilizes the pattern plating method to preserve the graphic portion of the circuit, while the full board copper plating process involves copper-plating the entire board. Etching quality, equipment adjustment, and maintenance are crucial in achieving high-quality etching outcomes in PCB production.
The etching procedure of the external circuit on the PCB substrate Read More »
Properties and uses of copper and nickel plating: Copper plating is soft, malleable, and has good thermal and electrical conductivity, primarily used as a base layer in multi-layer plating. Nickel plating quickly forms a thin passivation film for excellent stability in the air, commonly employed in protective-decorative plating applications.
Properties and Applications of PCB Copper Plating and Nickel Plating Read More »
General copper plating is used to reduce ground wire impedance, suppress noise, and reduce high-frequency interference, with the addition of grids for aesthetics and manufacturing process considerations.
Properties and uses of copper and nickel plating: Copper plating is soft, malleable, and has good thermal and electrical conductivity, primarily used as a base layer in multi-layer plating. Nickel plating quickly forms a thin passivation film for excellent stability in the air, commonly employed in protective-decorative plating applications.
Properties and Applications of PCB Copper Plating and Nickel Plating Read More »
General copper plating is used to reduce ground wire impedance, suppress noise, and reduce high-frequency interference, with the addition of grids for aesthetics and manufacturing process considerations.
PCB drilling is a crucial process in PCB manufacturing, involving through hole, blind hole, and buried hole drilling, which are essential for connecting circuits in different layers of the board and ensuring the board’s usability and functionality.
Three commonly used types of PCB drilling techniques Read More »
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