After developing the copper thickness of the exposed circuits needs to be increased by a secondary copper plating namely pattern plating The purpose is to make the hole copper and surface copper of
PCB lamination is the process of bonding multiple layers of a circuit board into a unified structure through stages like kiss pressure, full pressure, and cold pressure, which ensures the board’s electrical connectivity, dimensional stability, and overall quality.
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Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
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