The causes and elimination of faults in PCB electroplating nickel process include organic pollution leading to makeng and pinholes, roughness and burrs due to impurities, low adhesion from poor deoxidation, coating brittleness and poor weldability from organic and heavy metal pollution, uneven color and dark coating from metal pollution, coating burn from various factors, low deposition rate from low pH or current density, blistering or peeling from various factors, and anode passivation from insufficient anode activator and other factors.