This article discusses the challenges and solutions in ensuring signal integrity and meeting timing requirements for DDR3 memory design in high-speed PCB systems, using Cadence’s time-domain analysis tool for simulation and offering design improvements to optimize system reliability.
PCB Simulation Design and Signal Integrity Analysis in PCB Systems Read More »
For high-frequency circuit boards, keep signal leads short, minimize layer transitions and vias, reduce crosstalk with proper spacing and grounding, and use high-frequency decoupling capacitors. Additionally, improve PCB wiring quality through flexible designs, consider soldering factors, and apply effective wiring techniques.
High-frequency circuit board and PCB fabrication services Read More »
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