The development of horizontal electroplating technology offers a solution to the challenges posed by high-density PCB board manufacturing, providing benefits such as increased efficiency, reduced energy consumption, and improved environmental impact.
The advancement of microelectronics technology has led to the development of multilayer PCBs with complex circuit patterns, posing challenges in deep hole electroplating. Horizontal electroplating technology is introduced to address these challenges by enhancing current and additives for better copper deposition control.
Introduction to Horizontal Electroplating Technology for PCB Boards Read More »
With the rapid advancement of microelectronics, printed circuit board manufacturing is becoming more complex, with deep blind holes and high aspect ratios requiring advanced horizontal electroplating technology to ensure high-quality and high-reliability interconnect holes.
Horizontal Electroplating Process for High-Precision PCB Circuit Boards Read More »
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