A PCB transmission line’s loss, known as insertion loss (αt), combines conductor loss (αc), dielectric loss (αd), radiation loss (αr), and leakage loss (αl), with a focus on conductor and dielectric losses influenced by signal trace resistance and dielectric properties.
What signal degradation occurs in the transmission line of the circuit board? Read More »
High-frequency circuit boards require substrates with low and stable dielectric constants (Dk), minimal dielectric loss, consistent thermal expansion coefficients of copper foil, and properties such as heat and chemical resistance, impact strength, and peel strength. These materials are crucial for maintaining signal integrity and operational stability, particularly in applications above 1GHz where Teflon-based substrates like FR4 are commonly used to optimize performance.
High-frequency PCB substrate requirements and characteristics Read More »
High-frequency PCBs are crucial in communication electronics and advancing sectors like air transportation and satellites. Selecting PCB substrates involves prioritizing low and stable dielectric constants (Dk) for faster signal transmission, minimizing dielectric loss, and considering material properties such as consistent copper foil thermal expansion, low water absorption, and robust mechanical characteristics. Teflon is preferred above 5GHz, while FR-4 suits 1-10GHz, with material choice ultimately tailored to specific needs like high stability and signal quality maintenance under varied conditions.
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