drag soldering

Characteristics of PCB Manufacturing Processes

The PCB industry is evolving with technologies like reflow and selective soldering, which offer cost-effective solutions for soldering through-hole components while addressing challenges like temperature sensitivity and oxidation, with selective soldering providing precise, efficient methods for complex, small-scale soldering tasks.

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Causes and Solutions of PCB Soldering Defects

In recent electronic PCB board industry developments, reflow soldering has emerged as a dominant trend, enabling the reflow soldering of even through-hole components (known as through-hole reflow soldering) to minimize production costs by completing all solder joints simultaneously. However, for temperature-sensitive components, whether plug-in or SMD, the focus has shifted to selective soldering, which complements reflow soldering in most applications. Selective soldering targets specific areas, minimizing heat transfer and allowing for efficient soldering of through-hole components, crucial for future lead-free processes.

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