PCB inner layer circuits processing
In the previous steps we have completed the creation of all the inner layer circuits and the required holes ThroughBuriedBlind holes Next we have to enter the outer layer imaging process of the
dry film lamination
Inner Layer Multi-Layer PCB Fabrication Process – 03 – PCB Production Details – Wellcircuits
Surface Pre-TreatmentThe copper sheet after cutting has oxides grease and other impurities attached to the surface which firstly needs to be pretreated The main purpose of pretreatment is to remove