Dielectric strength measures a material’s ability to withstand high voltage without breaking down, while the dielectric constant indicates its ability to store electrical energy and affects signal propagation and capacitance in electronic circuits, making them crucial for FR4’s role as an electrical insulator in electronics.
The structure of a PCB consists of two main parts: a substrate made from engineering plastics with excellent thermal and electrical insulation properties, and a circuit layer comprising copper foil, engraved according to design specifications to form the core circuit.
The FR-4 grade materials used in PCBs comprise epoxy resin, glass fiber cloth, and aluminum substrate, offering flame resistance, electrical insulation, and heat dissipation, crucial for diverse applications in industries like LED lighting.
The aluminum substrate offers excellent thermal conductivity, lightweight design, and electrical insulation, making it ideal for electronic devices that require efficient cooling, durability, and safety, as well as applications in industries such as automotive and LED lighting.
Ceramic substrate is a special process plate with copper foil bonded to alumina or aluminum nitride at high temperatures, providing excellent electrical insulation, high thermal conductivity, and strong adhesion, making it the fundamental material for high-power electronic circuits and interconnection technology. Types include alumina, aluminum nitride, silicon nitride, and silicon carbide, each with specific characteristics and suitability for electronic packaging in various industries.
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