electroless copper deposition

High-frequency microwave PCB fabrication challenge

Processing high-frequency PTFE boards requires special techniques for drilling, solder mask printing, hot air leveling, milling shape, transport, etching, and electroless copper deposition, as well as considerations for substrates like ε3.38 and Rogers RO4003.

High-frequency microwave PCB fabrication challenge Read More »

Advanced Technology in PCB Multilayer Circuit Boards: Part 4

The semi-additive method for precision fine wire technology involves electroless copper deposition, dry film application, pattern plating, and etching, enabling production of thinner and closely spaced lines with minimal side etching or distortion, requiring proficiency in electroless thick copper and graphic plating technologies.

Advanced Technology in PCB Multilayer Circuit Boards: Part 4 Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)