Electroless Nickel/Immersion Gold

How to select between HASL, ENIG, OSP, and other PCB surface finishes

The choice of PCB surface treatment (HASL, ENIG, or OSP) depends on factors such as cost, component size, solderability, and environmental concerns, with each method offering distinct advantages and disadvantages for different applications.

How to select between HASL, ENIG, OSP, and other PCB surface finishes Read More »

How to select between HASL, ENIG, OSP, and other PCB surface finishes

The choice of PCB surface treatment (HASL, ENIG, or OSP) depends on factors such as cost, component size, solderability, and environmental concerns, with each method offering distinct advantages and disadvantages for different applications.

How to select between HASL, ENIG, OSP, and other PCB surface finishes Read More »

Typical Applications of PCB Surface Treatment Processes

The choice of PCB surface treatment processes depends on the final assembly components, with five common methods including hot air leveling, organic coating, electroless nickel/immersion gold, immersion silver, and immersion tin, each offering specific advantages and limitations for different applications.

Typical Applications of PCB Surface Treatment Processes Read More »

Characteristics and Development Trends in PCB Surface Treatment Processes

The electroless nickel/immersion gold process provides a thick protective layer for PCBs, enhancing electrical properties and offering environmental tolerance. Immersion silver falls between organic coating and electroless nickel/immersion gold in complexity, providing good electrical performance. Immersion tin shows promise but faces issues such as tin whisker formation and migration. Other widely used surface treatment processes include nickel-gold electroplating and electroless palladium plating for enhanced welding reliability and surface smoothness.

Characteristics and Development Trends in PCB Surface Treatment Processes Read More »

Characteristics and Development Trends in PCB Surface Treatment Processes

The electroless nickel/immersion gold process provides a thick protective layer for PCBs, enhancing electrical properties and offering environmental tolerance. Immersion silver falls between organic coating and electroless nickel/immersion gold in complexity, providing good electrical performance. Immersion tin shows promise but faces issues such as tin whisker formation and migration. Other widely used surface treatment processes include nickel-gold electroplating and electroless palladium plating for enhanced welding reliability and surface smoothness.

Characteristics and Development Trends in PCB Surface Treatment Processes Read More »

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