As environmental concerns rise, PCB surface treatment processes, including hot air leveling, organic coating, and electroless nickel/immersion gold, are evolving to enhance solderability, electrical performance, and environmental impact.
PCB Grounding and Surface Treatment Technologies” Read More »
Common PCB surface treatment processes include OSP, electroless nickel plating/gold immersion, silver immersion, and tin immersion. Silver immersion offers simplicity and speed, maintaining good electrical performance and solderability despite losing luster over time, lacking the physical strength of electroless nickel plating/gold immersion. Tin dipping, while matching any solder type, faces reliability issues like tin whiskers and migration, mitigated by organic additives for improved thermal stability and solderability. OSP forms an organic barrier on copper, providing oxidation resistance and straightforward process control, widely used for its cost-effectiveness. Electroless nickel plating/gold immersion offers long-term protection and superior electrical performance compared to OSP, thanks to a thick nickel-gold alloy layer inhibiting copper diffusion, suitable for various electronic applications.
What are the distinctions between electroplated nickel gold and gold plating on PCBs? Read More »
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