Nickel, gold, tin, silver, and palladium are various plating materials used in printed circuit boards, each serving different purposes and adhering to specific standards for thickness, uniformity, and performance in soldering and bonding.
Overview of PCB (Printed Circuit Board) Coatings Read More »
The electroless nickel/immersion gold process provides a thick protective layer for PCBs, enhancing electrical properties and offering environmental tolerance. Immersion silver falls between organic coating and electroless nickel/immersion gold in complexity, providing good electrical performance. Immersion tin shows promise but faces issues such as tin whisker formation and migration. Other widely used surface treatment processes include nickel-gold electroplating and electroless palladium plating for enhanced welding reliability and surface smoothness.
Characteristics and Development Trends in PCB Surface Treatment Processes Read More »
The electroless nickel/immersion gold process provides a thick protective layer for PCBs, enhancing electrical properties and offering environmental tolerance. Immersion silver falls between organic coating and electroless nickel/immersion gold in complexity, providing good electrical performance. Immersion tin shows promise but faces issues such as tin whisker formation and migration. Other widely used surface treatment processes include nickel-gold electroplating and electroless palladium plating for enhanced welding reliability and surface smoothness.
Characteristics and Development Trends in PCB Surface Treatment Processes Read More »
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