electrolytic copper foil

Advancement in Copper Foil Technology for PCBs

The evolution of PCB copper foil production, from its origins in waterproofing wooden roofs in 1937 at the Anaconda Copper Refinery to becoming a pivotal component in the global electronic information industry by the early 1950s, marks a transformative journey linking technological advancements with industrial growth.

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Flex PCB Copper Fall-off Analysis

In general, the pressing process does not affect the bonding force between the copper foil and the substrate in the laminate, but contamination or damage during lamination can result in insufficient bonding and poor peeling strength, leading to potential copper wire fall-off. In addition, the use of poor quality foil or mismatched copper foil and resin can also lead to inadequate peeling strength and copper wire shedding.

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Factors Leading to Detachment of Copper Traces on Impedance-Controlled

Copper wire detachment on impedance circuit boards can be attributed to issues such as over-etched copper foil, residual etching solution, unreasonable circuit design, abnormal electrolytic copper foil, and poor etching of potion. Selecting a manufacturer with robust process capabilities and quality materials can help mitigate this problem.

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