High-Speed PCB Board Design Using Cadence
High-speed PCB design involves intricate circuits requiring meticulous attention to signal integrity, electromagnetic compatibility, and power integrity for optimal performance in modern electronics.
electromagnetic compatibility
Assessing FPC Quality: Criteria for Good vs. Faulty Flexible PCBs
Quality FPC flexible boards must meet size and thickness standards, have proper surface finish and color, exhibit visually appealing weld seam appearance, ensure component functionality, adhere to line specifications, maintain copper adhesion and oxidation resistance, possess electromagnetic compatibility, shape stability, environmental resistance, and mechanical properties.
Assessing FPC Quality: Criteria for Good vs. Faulty Flexible PCBs Read More »
Designing Partitions for Mixed Signal PCB Boards
The design of mixed-signal PCB boards is intricate, with component layout and wiring, power and ground wire management impacting circuit performance and EMC. Segregating digital and analog grounds can enhance performance, while proper layout and partitioning are key to minimizing interference and optimizing design quality.
Designing Partitions for Mixed Signal PCB Boards Read More »
10-year-old engineer summarizes PCB wiring techniques
1. When laying out PCB components, ensure dense concentration within circuit modules, separate digital and analog circuits, avoid mounting near non-mounting holes, vias beneath horizontal components, and maintain proper distances between components, power sockets, and heat sources. 2. Follow component wiring rules to maintain proper spacing and widths for power and signal lines, via holes, and pad and aperture sizes. 3. To improve anti-interference and electromagnetic compatibility, use low-speed chips when possible, minimize signal reflection, filter high-noise areas, and maintain proper grounding and power supply connections.
10-year-old engineer summarizes PCB wiring techniques Read More »
Considerations for PCB Board Stackup Design
When designing PCB board stack-up, pay attention to ensuring each trace layer has an adjacent reference layer and keeping the adjacent main power supply layer and ground layer apart to provide larger coupling capacitance. It’s important to consider the potential issues with different layer designs and their impact on EMI emissions and electromagnetic compatibility.
Mitigate electromagnetic compatibility issues through strategic layering, layout, and routing of PCB boards
In addition to component selection and circuit design, good PCB board design is crucial for electromagnetic compatibility, focusing on minimizing reflow area and maintaining proper return current paths. The lecture will cover PCB layering strategy, layout skills, and wiring rules, emphasizing the importance of signal separation, power and ground plane placement, and signal line design to optimize EMC performance.