electronic assembly

Characteristics of the PCBA Supply Chain and Its Production Processes

Today, I will overview the PCBA processing supply chain, which consists of four tiers of companies, highlighting their roles in design, assembly, and the complexities of product diversity, planning, production processes, and cost calculations in a globalized market.

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Flux Characteristics in PCBA Soldering Processes

Flux is essential in PCB processing for quality soldering, removing oxides and ensuring cleanliness, with rosin as a main component, influencing electronic product quality, offering stable storage, non-stick properties, easy residue removal, and facilitating soldering processes. WellCircuits Limited, a leading FPC manufacturer, welcomes inquiries from new customers.

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Factors Influencing BGA Soldering Quality

The emergence of Ball Grid Array (BGA) packaging, with solder balls replacing pins, revolutionizes electronic assembly, offering versatility and overcoming limitations of traditional packages like Quad Flat Packages (QFP), leading to derivative packages like Chip Scale Packaging (CSP). BGA assembly involves considerations such as pad design, solder paste printing, alignment accuracy, temperature profile, and defect prevention. Prioritizing CAD tracking feasibility and PCB manufacturability, BGA pad design aims to minimize soldering defects and accommodate future rework, with types like dog-bone pads requiring careful sizing to avoid manufacturing issues like solder bridging.

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