electronic miniaturization

To understand the fundamental principles of FPC placement.

The integration of SMD on FPC is crucial for miniaturizing electronics, requiring careful process management for solder paste printing, placement, and welding to ensure high precision and reliability.

To understand the fundamental principles of FPC placement. Read More »

Manufacturing of metallized half-hole circuit boards

The rapid miniaturization and multifunctionality of electronic products have led to challenges in PCB manufacturing, particularly with metallized half-hole PCBs, which require improved processing techniques to address issues like copper discoloration, burrs, and short circuits while enhancing yield and performance.

Manufacturing of metallized half-hole circuit boards Read More »

Strategies for Material Optimization in Wuxi SMD Processing

Modern electronic products benefit from SMT due to their reduced size and weight, improved reliability and anti-vibration capabilities, cost savings through automation, and alignment with the trend towards miniaturization and high-quality, high-efficiency production.

Strategies for Material Optimization in Wuxi SMD Processing Read More »

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