The principles of PCB substrate design focus on optimizing electrical performance and manufacturing efficiency through careful pad alignment, proper electroplating, and precise layout of components, traces, and vias, ensuring signal integrity and minimizing design flaws.
PCB Circuit Board Design – Principles of Substrate Design Read More »
for most resin materials:Spray paintingSpray painting is one of the main coloring processes for 3D printed products. It is the application of specific pigments to the surface of 3D printed products by…
What surface finishes are available for 3D printing? – 3D Printing – Wellcircuits Read More »
The invention introduces a process for gold-cladding PCB board sides using nickel-gold electroplating, allowing simultaneous gold plating of both the top layer and sidewalls by exposing the copper surface through etching and applying a dry film.
Edge Metallization of PCB: Gold Finger Technology Read More »
The article examines how advancements in technology and industry impact PCB drilling, highlighting key factors such as equipment quality, material issues, operating conditions, and nozzle control, while also considering the challenges of drilling size ratios and secondary drilling.
What are the key factors that influence PCB board drilling? Read More »
1. Small air bubbles in FPC circuit boards result from narrow wire frame spacing and excessive height, causing solder mask material to trap gas during printing. Solution: Ensure complete material coverage during screen printing and control electroplating current. 2. Solder mask hole issues stem from delayed paper printing, leading to ink residue accumulation and low mesh screens. Solution: Print paper promptly, use high mesh screens, and adjust printing material viscosity and angle. 3. Skipped printing occurs due to excessive electroplating current and gaps in the squeegee. Solution: Control electroplating current and ensure gap-free squeegees, inspecting for copper foil oxidation during screen printing. 4. Pinholes in patterns arise from debris on the photographing base plate obstructing exposure. Solution: Maintain base plate cleanliness throughout the exposure process.
The electroplating process of the PCB board consists of acid bright copper electroplating, nickel/gold electroplating, and other steps including pickling, pattern transfer, acid degreasing, micro-etching, and tin plating, with specific parameters and maintenance practices outlined for each step.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.