electroplating processes

Is ALV HDI technology being mass-produced in PCB manufacturing?

The PCB industry is challenged by the need for increased layer counts and reduced thickness in the context of compact electronic devices, leading to issues in dimensional stability and signal performance, while advancements in ALV HDI technology aim to enhance mass production efficiency and address cost and reliability demands.

Is ALV HDI technology being mass-produced in PCB manufacturing? Read More »

The classification and process flow for multilayer PCB electroplating

The classification and process flow for multilayer PCB electroplating include steps like pickling, copper plating, acid degreasing, micro etching, tin and nickel plating, and gold plating, with specific guidelines for each process to ensure quality and prevent contamination.

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