Description and reasons for poor plating during PCB electroplating include recess plating, loose dendritic coating, double-layer plating, blackened coating, passive peeling, replacement peeling, peeling due to oil pollution, dark round spot coating, uneven gloss and thickness, and chemical fiber contamination.
Description and Causes of Deficient Plating in the Electroplating Process Read More »
The one-step copper electroplating method in PCB production eliminates uneven copper thickness and local over-etching issues.
One-Step Electroplating Copper Production PCB Process and Its Advantages Read More »
3. Various processes can lead to pit formation during electroplating, including copper immersion, pattern transfer, and inadequate cleaning during pre-treatment and plating. 4. Issues with air agitation, cotton cores, and cleaning after degreasing can result in whitish or uneven color on the board surface during electroplating. Concluding Remarks: Troubleshooting and innovation are essential for improving craftsmanship and achieving high-quality coatings in the acid copper plating process.
Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3 Read More »
The presence of copper particles on a PCB board surface can be attributed to various factors such as copper sinking, pattern transfer, and electroplating processes. It is crucial to maintain proper bath parameters, production operations, materials, and process maintenance to prevent issues with copper particle formation.
Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Part 2 Read More »
Copper is commonly used on printed circuit boards for interconnecting components, but requires protection from oxidation and corrosion through technologies like organic paint, oxide film, and electroplating, with gold being a common plating material for high wear resistance and low contact resistance.
The Significance of Electroplating in PCB Manufacturing Read More »
Description and reasons for poor plating during PCB electroplating include recess plating, loose dendritic coating, double-layer plating, blackened coating, passive peeling, replacement peeling, peeling due to oil pollution, dark round spot coating, uneven gloss and thickness, and chemical fiber contamination.
Description and Causes of Deficient Plating in the Electroplating Process Read More »
The one-step copper electroplating method in PCB production eliminates uneven copper thickness and local over-etching issues.
One-Step Electroplating Copper Production PCB Process and Its Advantages Read More »
The purpose of PCB etching is to complete the circuit board after electroplating, including film removal, line etching, and stripping tin and lead, with the goal of achieving high-quality etching for successful PCB production.
Improving the Quality of PCB Circuit Board Etching Process Read More »
Under the electric field, ions in the electroplating solution migrate at a rate determined by the potential drop and viscosity, while the use of horizontal electroplating systems, heating technology, and process control measures can achieve more uniform coating thickness and faster plating rates.
PCB Horizontal Electroplating Process for High-Precision Circuit Boards Part 2 Read More »
The resin plug hole process is widely favored for high-precision PCB boards, but overcoming difficulties in production is essential to improve quality, and understanding PCB slotting is crucial for ensuring voltage withstand and reducing EMC radiation.
Manufacturing Processes for PCB Resin Plug Holes and PCB Slotting Read More »
China First 7-Day Delivery PCB Factory, Free Samples Available.
Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.