Epoxy Resin

Manufacturing Process of Copper Clad Laminate for PCBs

PCB board copper clad laminate is a substrate material used for making printed circuit boards, supporting components while enabling electrical connections or insulation. The manufacturing process involves impregnating materials like glass fiber cloth or paper with adhesives such as epoxy or phenolic resin, followed by lamination with copper foil and application of heat and pressure to create the final laminate.

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Intro to Common PCB Raw Materials

The FR-4 grade materials used in PCBs comprise epoxy resin, glass fiber cloth, and aluminum substrate, offering flame resistance, electrical insulation, and heat dissipation, crucial for diverse applications in industries like LED lighting.

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Could you please provide information on the material used in the FR4 PCB?

FR4 is a fire-resistant material grade used in circuit boards, made from epoxy resin, filler, and glass fiber, with high mechanical strength, good electrical performance, and high working temperature, widely used for general electronic products and PCB technology.

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Introduction and Characteristics of Black FR4 PCB

The black FR4 PCB insulation board, also known as fiberglass board, is a versatile material widely used for wall and ceiling decorations, injection molding, and high-performance electronic insulation, known for its sound absorption, insulation, environmental friendliness, and flame retardant properties.

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Can you provide some information about FR4 material?

FR-4 is a fire-resistant material grade used in circuit boards, known for its high-temperature resistance, corrosion resistance, mechanical strength, insulation performance, dimensional stability, and environmental friendliness, and is commonly used in electronic manufacturing, power systems, and mechanical systems.

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Comparison of FR-4 and Aluminum PCB Substrates

FR4 circuit boards are made of glass fiber and epoxy resin, offering good heat resistance and electrical insulation. Aluminum plates, on the other hand, are metal-based with excellent heat dissipation capabilities and are suitable for high-power electronic products. Both materials have their own advantages and are used in different electronic applications.

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