ESD protection

The Risks and Mitigation of EOS and ESD in PCBA

This article discusses the risks of Electrostatic Discharge (ESD) and Electrical Overload (EOS) in printed circuit board assemblies (PCBAs), highlighting the need for proper handling, design, and protection measures to prevent damage to sensitive components during assembly and testing.

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Are you aware of the purpose behind PCB layout design?

In PCB design, it’s best to use a tree-like ground layout to minimize interference, avoid connecting grounds of separate power supplies to reduce crosstalk, ensure case protection is tight and non-conductive, consider a chip’s ESD characteristics during selection, share a common ground in multi-board circuits unless conditions allow otherwise, and maintain spacing and proper grounding to prevent crosstalk.

Are you aware of the purpose behind PCB layout design? Read More »

Are you familiar with designing PCBs to mitigate antistatic ESD?

Effective ESD protection in PCB board design involves strategic layering, proper layout, and meticulous installation. Adjustments during the design phase focus on adding or reducing components based on predictive analysis to mitigate ESD risks. Recommended preventive measures include utilizing multi-layer PCBs with dedicated ground and power planes, employing intertwined power and ground grids for double-sided PCBs, and implementing chassis ground traces below connectors vulnerable to ESD. These measures collectively enhance PCB resilience in diverse operational environments.

Are you familiar with designing PCBs to mitigate antistatic ESD? Read More »

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