The PCB production process involves cutting, applying dry film, exposing, developing, etching, film removal, drilling, copper plating, applying solder masks, silk screening, surface treatment, and electrical testing, culminating in the final product.
The PCB manufacturing process involves complex physical and chemical reactions to form circuit patterns from a light board. This article focuses on the final crucial step: etching, using the predominant “pattern plating method” where copper foil is selectively dissolved after applying a lead-tin resist layer. Alternative methods include using photosensitive film or a full board copper plating process, each impacting production complexity and quality.
Methods and Techniques for Controlling the PCB Etching Process Read More »
The text explores various methods and challenges in PCB etching, emphasizing the complex chemical and physical reactions involved, particularly focusing on etching quality, equipment adjustments, and maintenance practices.
PCB fabrication: etching process and process control Read More »
The common process for processing printed circuit boards utilizes the pattern plating method to preserve the graphic portion of the circuit, while the full board copper plating process involves copper-plating the entire board. Etching quality, equipment adjustment, and maintenance are crucial in achieving high-quality etching outcomes in PCB production.
The etching procedure of the external circuit on the PCB substrate Read More »
The negative film of impedance boards uses acid etching and preserves the required circuit, while the positive film uses alkaline etching and removes tin-lead protection to reveal the circuit.
The Distinction Between the Positive and Negative Impedance of a Circuit Board Read More »
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