Copper wire detachment on impedance circuit boards can be attributed to issues such as over-etched copper foil, residual etching solution, unreasonable circuit design, abnormal electrolytic copper foil, and poor etching of potion. Selecting a manufacturer with robust process capabilities and quality materials can help mitigate this problem.
Factors Leading to Detachment of Copper Traces on Impedance-Controlled Read More »
The selection of an appropriate etching solution is crucial for high-density thin wire image quality in PCB manufacturing, considering physical, chemical, and mechanical factors such as concentration, composition, temperature, foil thickness, circuit geometry, equipment type, spray technology, distance and pressure, surface tension, and viscosity.
Influential Factors on Etching Solution Characteristics in PCB Fabrication Read More »
Ammonia etching in printed circuit processing is a complex chemical reaction process that requires continuous operation and careful equipment design to achieve high-quality etching effects, with the key factor being the control of monovalent copper ions in the etching solution.
Equipment Adjustment and Corrosive Solution Interaction Study Read More »
Vacuum etching technology improves production accuracy and circuit quality, increases process capacity, and offers potential for producing thin and ultra-fine wire structural boards, with the option of an environmentally friendly regeneration system.
Analysis of PCB Vacuum Etching Technology Part 2 Read More »
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
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