1. Azole OSP is the preferred choice due to its high decomposition temperature and suitability for lead-free processes, crucial for selecting OSP type in PCB production. 2. OSP film thickness directly impacts solderability and thermal shock resistance; precise control is essential during PCB manufacturing. 3. OSP board production involves several critical steps: board placement, degreasing, washing, micro-etching, pre-soaking, application of OSP, and drying. 4. Key factors influencing OSP film thickness include degreasing effectiveness, micro-etching consistency, pre-soaking methods, OSP solution composition, pH control, temperature management, and dip coating time. 5. UV spectrometers or FIB technology are utilized for OSP film thickness measurement, ensuring adherence to industry standards. 6. Proper OSP board packaging and storage prevent film damage from humidity and temperature, crucial for maintaining solderability. 7. OSP boards require careful handling in SMT processes to avoid film damage, ensuring optimal solderability and component placement efficiency.