FPC

Double-sided FPC: Machining & Technics Standards for Shape & Hole.

Emerging FPC technologies, including chemical etching, enhance accuracy and efficiency, while guide holes improve alignment, predominantly through copper foil markings. Punching and milling methods offer versatility and cost-effectiveness, with CNC milling aiding rapid prototyping despite longer setup times. Integrated adjustment processing is optimal for low-volume, high-value products.

Double-sided FPC: Machining & Technics Standards for Shape & Hole. Read More »

Exploring PCB vs. FPC: A Concise Introduction

PCBs provide rigid support for electronics, while FPCs, with flexible polyimide substrates, offer versatility, enabling bendable designs and facilitating three-dimensional circuit structures, enhancing signal integrity and product reliability through efficient use of space and innovative interconnections.

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Common Production Problems and Detection Methods in FPC Manufacturing

FPCs offer significant advantages over rigid PCBs but face production challenges, necessitating rigorous testing. Existing defect detection methods are insufficient, requiring higher accuracy due to unique FPC characteristics, such as deformation-prone templates and reflective surfaces, making manual inspection costly and inefficient.

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FPC Coverlayer Film

Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.

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Fast and Efficient FPC Cutting Technique

The advantages of high precision, low cost, and good cutting effect have been fully realized and applied in the FPC, membrane switch, and backlight industries, offering more cost-effective and efficient cutting solutions compared to knife mold and laser cutting.

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FPC Coverlayer Film

Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.

FPC Coverlayer Film Read More »

Fast and Efficient FPC Cutting Technique

The advantages of high precision, low cost, and good cutting effect have been fully realized and applied in the FPC, membrane switch, and backlight industries, offering more cost-effective and efficient cutting solutions compared to knife mold and laser cutting.

Fast and Efficient FPC Cutting Technique Read More »

Minimum bend radius for flexible PCBs

As a PCB expert, understanding the importance of designing flexible PCBs with the ability to bend is crucial, with factors such as bending radius, lamination structure, substrate thickness, number of layers, and covering material flexibility all impacting the overall functionality and durability of the circuit board. Calculating the bending radius can be done using standard guidelines or formulas, with the minimum bending radius typically between 1mm and 6mm for single-layer and double-layer flexible PCBs to ensure reliable dynamic bending stress.

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What is the specified thermal resistance needed for the FPC flexible board?

The FPC flexible board requires a voltage resistance test to assess its current transmission capability and voltage withstand capacity. The use of high-current shrapnel micro pin modules as connection modules allows for current transmission and conduction within the range of 1-50A, providing overcurrent protection and a stable connection. The conductivity of the module is strong,

What is the specified thermal resistance needed for the FPC flexible board? Read More »

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