FPGAs in BGA format are prone to solder joint failures, impacting reliability in commercial and defense electronics. Addressing these challenges is crucial for ensuring consistent operational performance and mitigating downtime.
Failure Analysis of FPGA to PCB Welding Connection Read More »
As FPGAs evolve into programmable system-on-chips, designing PCBs with these chips becomes increasingly complex due to high circuit densities and data rates. Effective PCB design for high-speed FPGAs requires meticulous consideration of noise reduction, signal termination, impedance matching, and power distribution to fully utilize their capabilities.
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