FR4 material

PCBA Assembly Process: Synthetic Stone Furnace Trays

The causes of PCB deformation due to high temperatures, emphasizing the need for effective furnace tray materials to support increasingly thin electronic components during the SMT reflow process.

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Explanation of the analytical procedures for PCB prototyping parameters.

PCB proofing involves sending a PCB layout design to a manufacturer for trial production, with key considerations including material type, board layers, solder mask and silkscreen colors, copper thickness, via coverage, surface coating, and quantity.

Explanation of the analytical procedures for PCB prototyping parameters. Read More »

FR4 Dielectric Strength

Dielectric strength measures a material’s ability to withstand high voltage without breaking down, while the dielectric constant indicates its ability to store electrical energy and affects signal propagation and capacitance in electronic circuits, making them crucial for FR4’s role as an electrical insulator in electronics.

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