Supplementary production documentation necessary for Surface Mount Technology (SMT) processing.
Important precautions, test guidance, and considerations for factory patching process and testing requirements.
Important precautions, test guidance, and considerations for factory patching process and testing requirements.
The statement can be summarized as follows: “Non-electrolytic nickel coating on PCB boards serves multiple functions, including facilitating gold deposition, establishing strong connections, and preventing solder issues due to oxides or contaminants. Nickel’s purity is crucial for gold precipitation, with a balance of phosphorus content ensuring desired properties. Hardness matters for physical strength, especially in automotive applications. Copper is preferred for circuits, while gold’s conductivity is valuable for outer layers. Nickel’s thickness can impact high-frequency signals, and contact resistance is vital for long-term conductivity.”
Specifications for non-electrolytic nickel plating on PCBs Read More »
Printed circuit boards (PCBs) are a crucial component in the electronic industry, as they provide mechanical support for electronic components, achieve wiring and electrical connections, and improve the efficiency, quality, and reliability of electronic products.