Attention to detail is crucial in PCB design, as the differences between novice and experienced engineers often lie in the careful consideration of component placement, spacing, and orientation to ensure successful manufacturing and performance.
Which details are most beneficial for PCB engineers? Read More »
The rapid advancement in microelectronics is driving PCB manufacturing towards complex multilayer designs, necessitating improved electroplating techniques, particularly horizontal electroplating, to ensure uniform copper layer thickness and meet stringent quality standards.
Introduction to Horizontal Plating Technology for PCB Circuit Boards Read More »
In PCB layout, it’s crucial to review the design for routing efficiency, dimensional accuracy, component arrangement, accessibility, thermal management, and signal integrity, while also ensuring a logical division of functional areas for effective schematic reverse engineering.
The quality standards for PCB copper foil substrates are tightening due to the demand for lighter, thinner, and more reliable electronic products, necessitating improved manufacturing and inspection processes, including the transition to non-contact laser thickness measurement systems to enhance quality control.
Measurement of PCB Copper Foil Substrate Thickness Read More »
The flexible PCB substrate consists of insulating materials, adhesives, and copper conductors, requiring protective films to enhance reliability and precision, with various manufacturing methods evolving to address performance and cost issues.
The Evolving Trends in Flexible Printed Circuit (FPC) Substrate Materials Read More »
The article discusses recent discoveries in addressing micro short circuits in PCBs, primarily attributed to CAF, and outlines the investigation methods, laboratory findings, and proposed improvements by the board manufacturer to mitigate the issue.
Micro short circuit phenomena in PCB inner layers. Read More »
The different layers of a PCB circuit board, detailing the functions of top and bottom paste, solder, mechanical, and multi-layer graphics, as well as the importance of proper layer management in PCB design.
What is the function of layers in a printed circuit board (PCB)? Read More »
The formation of Intermetallic Compounds (IMC) during soldering indicates strong bonds in PCBA processing, yet fractures often occur at the IMC interface due to its inherent weakness compared to the surrounding metals.
The PCBA has experienced solder joint failure, resulting in component detachment. Read More »
The PCB manufacturing process is prone to defects from machine errors and human factors, particularly during slag removal, which can lead to issues like point-shaped ruptures and incomplete copper deposition if not carefully monitored throughout each processing stage.
Analysis of Anomalies in PCB Circuit Board Fabrication Read More »
PCB designs may look similar at first, but significant internal differences impact their reliability and performance, making high-quality design a crucial investment to avoid costly failures in critical applications.
Are you familiar with some key characteristics of PCB design? Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.