FPC, or flexible printed circuit, utilizes a flexible substrate like polyimide or polyester, allowing it to bend or fold for diverse applications, often protected by a cover layer. Connections to PCBs employ methods such as ENIG, tin-lead, SEG, OSP, and HASL, balancing technical advantages with environmental considerations.
Processing techniques for PCB pads and utilization of FPC materials Read More »
Effective thermal design of PCB circuits involves managing heat from electronic components, the PCB itself, and external sources by improving heat dissipation through PCB material, adding radiators or heat sinks, optimizing wiring, reducing thermal resistance, arranging components strategically, considering airflow, placing temperature-sensitive devices in cooler areas, and evenly distributing power to prevent hot spots.
High temperatures in printed circuit boards (PCBs) can lead to performance issues and structural damage, necessitating advanced thermal management techniques to ensure reliability and efficiency in high-power density applications.
Regarding a type of PCB designed for high-temperature resistance Read More »
PCB conformal coating thickness is crucial for reliability, as too thin can fail to protect and too thick can cause defects, while selective wave soldering enhances efficiency and reliability in soldering by targeting specific joints with customizable parameters.
PCB conformal coating and selective wave soldering system Read More »
Reel-to-reel operation streamlines the production of electronic components by using a retractable process that automates handling and reduces labor costs.
Terminology associated with flexible PCB (Printed Circuit Board) technology. Read More »
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