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Wellcircuits Enhances PCB Material with ShengYi Integration

WellCircuits sincerely appreciates the trust and support from our customers over the years. Your satisfaction and support drive us forward continuously. To further improve product quality and meet the marke…

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The various layers in PCB design

The various layers in PCB design, including mechanical, routing, silkscreen, solder mask, and drilling layers, as well as how to configure a 4-layer PCB in PowerPCB, highlighting design considerations such as signal integrity, routing strategies, and the selection of PCB software for optimal results.

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The rationale for blocking the vias on the PCB board.

The evolving production process for printed circuit boards (PCBs) and the importance of via hole plugging to meet increasing demands in surface mount technology (SMT) and ball grid array (BGA) assemblies, detailing various methods for plugging via holes to prevent issues such as solder short circuits, flux residue, and false soldering during wave soldering, with a focus on maintaining technical accuracy and quality control throughout the process.

The rationale for blocking the vias on the PCB board. Read More »

The rationale for blocking the vias on the PCB board.

The evolving production process for printed circuit boards (PCBs) and the importance of via hole plugging to meet increasing demands in surface mount technology (SMT) and ball grid array (BGA) assemblies, detailing various methods for plugging via holes to prevent issues such as solder short circuits, flux residue, and false soldering during wave soldering, with a focus on maintaining technical accuracy and quality control throughout the process.

The rationale for blocking the vias on the PCB board. Read More »

How to Determine the Temperature Tolerance of a PCB

The solder paste printing test requires using a soldered PCB for accurate thermocouple testing, selecting representative test points based on temperature zones, securely attaching thermocouples, and analyzing the temperature curve data to ensure proper reflow soldering without exceeding temperature limits.

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What are the key skills required for replacing an IC in PCB circuit design?

The article provides practical tips for replacing ICs in PCB circuit design, covering direct and indirect substitutions, different packaging and pin configurations, and the considerations needed to ensure performance is unaffected by the replacement.

What are the key skills required for replacing an IC in PCB circuit design? Read More »

How familiar are you with PCB anti-interference design techniques?

Anti-interference design is crucial in modern PCB engineering, addressing power supply noise, transmission line reflections, coupling methods, and electromagnetic interference (EMI) to enhance system performance and reliability.

How familiar are you with PCB anti-interference design techniques? Read More »

How can PCBs be interconnected effectively?

The interconnection methods for PCB boards include soldering (both wire and cable), direct soldering between boards, and using connectors (such as printed board sockets and standard pin connections), each offering various advantages in terms of reliability, ease of maintenance, and production efficiency.

How can PCBs be interconnected effectively? Read More »

Reasons for PCB Explosions During Processing and Proposed Solutions

The article outlines common causes of PCB explosions, emphasizing that insufficient heat resistance of substrates, moisture absorption, and low Tg of materials are significant contributors, highlighting the need for improved quality control during production.

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Signal integrity optimization and cross-segment analysis in high-speed PCBs.

The article discusses signal reflow and cross-segmentation in high-speed PCBs, explaining how current paths, grounding, and decoupling capacitors affect signal integrity and crosstalk, particularly at high frequencies.

Signal integrity optimization and cross-segment analysis in high-speed PCBs. Read More »

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