gold finger

Advantages of Immersion Gold PCB Boards

Surface treatments for printed circuit boards (PCBs) encompass various methods like gold plating, tin spraying, immersion gold, immersion silver, and OSP. These treatments cater to different needs, offering advantages such as oxidation resistance, good solderability, and environmental friendliness. Gold plating, though costly, remains vital for high-performance connectors, while tin plating predominates due to lower costs, especially in mainstream electronics like motherboards and memory modules. Immersion gold boards mitigate issues like the tin whisker effect, providing superior solderability and flatness, making them increasingly preferred in modern PCB applications.

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Immersion Gold (ENIG) and Gold Fingers

Immersion Gold (ENIG) is a surface treatment process that involves plating gold onto copper to prevent oxidation and improve conductivity, while Gold Finger refers to a row of equidistant square pads on a PCB circuit board used for electrical connections. The categories of PCB gold fingers include ordinary gold fingers, segmented gold fingers, and long and short gold fingers.

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PCB prototyping and small to medium batch circuit board manufacturing process

The manufacturing process of various types of PCB boards involves cutting material, baking board, drilling, copper sinking, circuit formation, etching, testing, quality control, surface treatment, silk screen printing, finishing, testing, packaging, and shipping.

PCB prototyping and small to medium batch circuit board manufacturing process Read More »

PCB prototyping and small to medium batch circuit board manufacturing process

The manufacturing process of various types of PCB boards involves cutting material, baking board, drilling, copper sinking, circuit formation, etching, testing, quality control, surface treatment, silk screen printing, finishing, testing, packaging, and shipping.

PCB prototyping and small to medium batch circuit board manufacturing process Read More »

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