The article explains the distinctions between hard gold, soft gold, and flash gold in PCB manufacturing, emphasizing their compositions, applications, and electroplating processes, while clarifying common misconceptions in the industry.
PCBA plate making is critical, with gold plating and tin plating processes being especially important for enhancing corrosion resistance and solderability.
The processes of PCB assembly involving gold plating and tin plating Read More »
Nickel, gold, tin, silver, and palladium are various plating materials used in printed circuit boards, each serving different purposes and adhering to specific standards for thickness, uniformity, and performance in soldering and bonding.
Overview of PCB (Printed Circuit Board) Coatings Read More »
1. PCB plating process: The process begins with pickling, followed by full-board electroplated copper, pattern transfer, acid degreasing, secondary countercurrent rinsing, micro etching, secondary countercurrent rinsing, pickling, tin plating, secondary countercurrent rinsing, countercurrent rinsing, pickling, pattern copper plating, secondary countercurrent rinsing, nickel plating, secondary washing, citric acid treatment, gold plating, and concludes with recycling and 2-3 pure water washes before drying. 2. Remove oxide from the plate surface, activate it, and maintain the acid concentration generally at 5%-10% to prevent instability in the sulfuric acid tank solution due to water introduction. Keep acid leaching brief to prevent PCB board oxidation. Promptly replace acid when turbid or excessively copper-laden to avoid surface contamination of electroplated copper cylinders and plates. 3. Also referred to as “primary copper,” it shields freshly deposited thin electroless copper to prevent post-oxidation acid erosion. The tank solution primarily contains copper sulfate and sulfuric acid, with a high acid and low copper formula ensuring uniform PCB surface thickness distribution and effective plating of deep holes and small apertures. Sulfuric acid content is maintained at 180-240 g/L, copper sulfate around 75 g/L, with trace chloride ions added for gloss enhancement. Typically, 3-5 ml/L of gloss agent per cylinder is used, adjusted based on production outcomes or 1,000 ampere-hours. 4. PCB full-board plating current is typically calculated at 2 amps per square decimeter, multiplied by the board’s platable area. For full-board plating, this equals board length in dm × board width in dm × 2 × 2A/dm². Copper cylinder temperature is maintained around room temperature, preferably not exceeding 32 degrees Celsius, often controlled at 22 degrees Celsius. In hot weather, a cooling temperature control system for the copper cylinder is recommended. The text has been refined for clarity and coherence while maintaining technical details of the PCB plating process and associated considerations.
PCB Supplier’s 9-Step Plating Process in Manufacturing Read More »
PCB immersion gold and gold plating are surface treatment techniques that enhance PCB durability and performance by applying thin gold coatings. Immersion gold (ENIG) involves a chemical bath deposition, forming a thicker gold layer through a redox reaction.
Differences: PCB Immersion Gold vs. Gold Plating in 80 characters Read More »
OSP serves as an insulating layer between copper and air, making it cost-effective but challenging due to transparency and non-conductivity. Gold plating enhances soldering and prevents corrosion, albeit at higher costs. ENEPIG, with a palladium layer, offers corrosion resistance and versatility. Immersion silver provides simplicity and speed, while immersion tin, though compatible with all solder types, historically faced reliability issues but has been improved with organic additives. Each surface treatment has unique characteristics, but ENEPIG stands out as versatile.
1. **Finger Row Electroplating:** Electroplating method for applying gold onto edge connectors or protruding contacts of circuit boards, involving steps like coating removal, abrasion, activation, nickel plating, gold treatment, and drying. 2. **Through-Hole Plating:** Process involving electroplating the entire wall of substrate drilled holes, addressing challenges like resin accumulation and poor adhesion, with potential solutions including chemical treatments or using low-viscosity ink for direct electroplating.
Four Special Electroplating Techniques for PCB Manufacturing: Part 1 Read More »
Question about gold plating process for PCB artwork, logo, or words. Can specific areas be gold plated or only pads and through holes? Designing stand out black PCB with gold plated logo.
The blackening of the gold plating layer on the PCB board commonly occurs during the copying process, and the problem can be analyzed and addressed through controlling nickel coating thickness, solution for nickel plating cylinder, and gold plating bottle control, as well as considering the PCB board layer types, design requirements, and optimizing the PCB board layer.
Gold plating is a common surface treatment for PCBs, with options for hard or soft plating depending on the specific needs of the application, offering benefits such as conductivity and wear resistance, but also adding to the cost of production.
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