The immersion gold process is a costly surface treatment for circuit boards, essential for specific applications like gold fingers and fine line widths, but less suitable for others, and it offers advantages in heat dissipation, soldering strength, and measurement reliability compared to alternative methods like OSP and silver treatments.
The Unique Role of the PCB Immersion Gold Process Read More »
The rising demand for FPC flexible circuit boards, driven by the trend towards smaller electronic products, highlights the differences between gold plating and immersion gold in surface technologies.
Comparing FPC Gold Plating and Immersion Gold Processes. Read More »
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