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Novel PCB Inspection and Verification Technology

Boundary Scan Test (BST), adhering to the IEEE1149.1 standard, is an emerging technology in printed circuit board (PCB) testing, offering simpler, faster, and more cost-effective solutions by utilizing a 5-pin test access port, providing a comprehensive suite of testing methods that eliminate the need for complex equipment while supporting diverse integrated circuits and enabling quick fault detection and diagnostics.

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Ultra-Low-Cost Hybrid Tuner for Single PCB Board Integration

The ULC tuner design presented in this article integrates RF and IF circuits, operates at 5V or 3.3V with lower power consumption, and utilizes a single-layer PCB board for cost reduction, supporting mixed TV signals and meeting strict requirements for analog receivers.

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Strategies for Mitigating RF Interference in PCB Interconnect Design

The challenges of high-frequency RF design in PCB board systems require techniques for managing interconnections, controlling return loss, and addressing crosstalk issues to ensure signal integrity and system performance. Consulting experienced engineers and utilizing advanced design methods can help achieve smaller, faster, and more cost-effective PCB board designs.

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Key Points to Consider when Manual Dip Soldering PCB Boards

The PCB manual dip soldering process includes plug-in, dip soldering, foot cutting, repair soldering, and cleaning, with each step requiring specific equipment and techniques for efficient and high-quality production.

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Analysis of Hidden Characteristics of Passive Components on PCBs

This article explains the behavior of passive components on PCB boards using mathematical equations and electromagnetic theory, essential for engineers designing electronic products to meet EMC standards. Understanding the hidden characteristics of components like wires, traces, resistors, capacitors, inductors, and transformers helps prevent EMI in the PCB board and optimize circuit design.

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Causes of Gold Plating Blackening on PCBs

The blackening of the gold plating layer on the PCB board commonly occurs during the copying process, and the problem can be analyzed and addressed through controlling nickel coating thickness, solution for nickel plating cylinder, and gold plating bottle control, as well as considering the PCB board layer types, design requirements, and optimizing the PCB board layer.

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