Surface treatments for PCB circuit boards, such as tin spraying (HASL), OSP, and immersion gold (ENIG), protect the copper from oxidation, enhance solderability, and meet the evolving needs of modern electronics, but each has its own advantages, limitations, and environmental considerations.
PCB proofing is crucial for effective ICT in manufacturing, with lead-free surface treatments becoming pivotal amid industry shifts and regulatory changes, impacting test quality and compliance.
Lead-Free PCB Surface Treatment Process for PCB Prototyping Read More »
HASL technology, while established, faces challenges in achieving consistent quality due to its operation in high-temperature, high-pressure environments. This paper discusses strategies to improve process control in HASL, focusing on flux selection, process parameter control, and achieving uniform solder coatings essential for PCB manufacturing.
Problem with tin plating solution on PCBs causing soldering issues due to flux interaction, seeking alternative solutions like thicker tin or HASL for SMD components.
OSP serves as an insulating layer between copper and air, making it cost-effective but challenging due to transparency and non-conductivity. Gold plating enhances soldering and prevents corrosion, albeit at higher costs. ENEPIG, with a palladium layer, offers corrosion resistance and versatility. Immersion silver provides simplicity and speed, while immersion tin, though compatible with all solder types, historically faced reliability issues but has been improved with organic additives. Each surface treatment has unique characteristics, but ENEPIG stands out as versatile.
PCB factories use various surface treatment methods for PCB prototyping, each with unique characteristics. Chemical silver is recommended for lead-free soldering and SMT, while HASL offers complete wetting of the copper surface and is suitable for lead-free soldering and visual inspection. Nickel gold is suitable for lead-free soldering, SMT, and resistance to environmental attacks. Electroplated nickel-gold is widely used for contact switch design, gold wire binding, and electrical testing. Nickel-Palladium-Gold is suitable for bonding gold and aluminum wires, lead-free soldering, and is cheaper compared to ENIG.
Summary: The speaker wants to use white silkscreen on a PCB with exposed tin for cosmetic effect, without solder mask. They are concerned about the silkscreen’s adhesion to the metal.
Silkscreen printing on bare copper with HASL – will it adhere? Read More »
The speaker is questioning the preference for immersion gold finish over HASL for soldering QFN and QFP components.
Which service should be used for QFN and QFP, HASL or ENIG? Read More »
Problem with surface finishing, seeking solution. Thank you.
6 layers with 6 ounces in each layer, all with HASL coating. Read More »
Seeking FR-4 material options that are close to white for a project mimicking vintage control panels, and looking for recommended PCB suppliers familiar with such materials.
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