HASL alternatives

Non-nickel surface treatment processes for multilayer PCBs

The non-nickel PCB surface treatment process for multilayer PCBs has advanced to address limitations of HASL and enhance protection against oxidation while ensuring a durable and conductive surface through the use of barrier layers and precise chemical treatments.

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Final Coating Overview for PCB Surfaces

Important changes in final coating process for PCB manufacturing have been driven by the need to overcome limitations of HASL and increase use of HASL alternatives, with the goal of protecting the surface of circuit copper foil with a durable, conductive surface for component assembly through electroless nickel coating.

Final Coating Overview for PCB Surfaces Read More »

Final Coating Overview for PCB Surfaces

Important changes in final coating process for PCB manufacturing have been driven by the need to overcome limitations of HASL and increase use of HASL alternatives, with the goal of protecting the surface of circuit copper foil with a durable, conductive surface for component assembly through electroless nickel coating.

Final Coating Overview for PCB Surfaces Read More »

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