As PCB technology advances, the growing complexity of designs necessitates advanced PCB design software that improves efficiency, reduces errors, and supports multi-functional, high-performance circuits for industries like healthcare, aerospace, and IoT, while also addressing factors such as design complexity, collaboration, and regular updates.
HDI (High Density Interconnect) PCBs feature advanced wiring density with microvias as small as 0.006 inches, utilizing high-performance materials for flawless performance in industrial applications, making them pivotal in modern PCB technology’s rapid growth.
A Comprehensive Compilation of CAM Manufacturing Techniques for HDI Read More »
HDI technology drives innovation in PCB manufacturing, enabling precise, high-density interconnections through 0.1mm laser drilling, crucial for meeting evolving industry demands and advancing electronic progress.
Global Vision Technology implements PDCA management improvement guided by ISO9001 standards, refining internal processes and supply chain management to provide quality manufacturing services. This includes rigorous oversight of process design, DFM inspection, PCBA manufacturing, and personnel training, ensuring a robust quality management system. Additionally, DFM inspections ensure thorough checks of design elements, while new product introduction meetings streamline communication and planning across departments. PCB board oversight guarantees quality through collaboration with top suppliers and strict quality control measures, while electronic components procurement follows precise specifications and formal channels, supported by original technical support.
Build-up Multilayer Boards (BUM-PCBs) utilize layered insulation substrate and additive methods to create high-density interconnections, revolutionizing electronic packaging for smaller, lighter, and thinner devices.
Introduction to Build-up Multilayer Board Manufacturing: Part 1 Read More »
Multi-sided PCB designs, especially those with more than two layers, require careful consideration of internal power and ground planes to address issues such as thermal problems, EMI, and ESD. Manufacturers must balance these layers to prevent warping or twisting during assembly, with WellCircuits Limited offering high-precision solutions for a range of customer needs.
The HDI driver framework provides a stable and unified hardware interface for the system, ensuring system services can run on different hardware without additional adaptation through HDI compatibility rules and two deployment modes.
IPC’s HDI specific implementation methods and capabilities Read More »
HDI technology is utilized in the production of printed circuit boards, allowing for high circuit distribution density and miniaturized product designs for electronic devices such as smartphones and digital cameras, through high-density wiring and multi-layer structures. This technology also requires high-precision manufacturing processes to achieve small sizes and complex circuit designs.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.