HDI PCB

PCB Micro Blind and Buried Via Technology

Significance of HDI (High-Density Interconnect) circuit boards in modern electronics, emphasizing their use of micro-blind via technology to enhance circuit density and performance while addressing challenges in manufacturing alignment, glue flow, and graphic transfer.

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Selecting PCB Surface Treatments: Expert Guide

The evolution of PCB surface treatment technology, influenced by environmental concerns and evolving industry standards, emphasizes lead-free and halogen-free processes like organic coating and electroless nickel plating/immersion gold, while also considering factors like component type and assembly requirements, leading to a dynamic landscape of options with a focus on meeting customer needs and environmental standards.

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Five Design Techniques for High Efficiency Manufacturing of HDI PCBs

HDI PCB is a specialized circuit board designed for high-density surface components and high-frequency signal transmission. To optimize manufacturing, it is essential to select a contract manufacturer with expertise in HDI PCB electronic manufacturing and to follow specific design techniques to minimize complexity and costs.

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Resin Filled Via Holes in HDI PCBs

As a PCB expert, I specialize in filling various types of resin plug holes, such as mechanical through holes and blind buried holes, using conductive and non-conductive resin. Filling these holes is crucial for reducing vacuum during lamination, preventing surface depression, achieving inter-layer interconnection, and enabling higher-density wiring. In HDI PCB processing, resin plug holes are essential for BGA parts and meeting the design requirements of thin dielectric layers. Resin plug holes also improve the mechanical strength and durability of PCBs while isolating different circuit layers to enhance performance and stability. The application of resin plug-hole technology in PCBs is increasingly widespread, especially in multi-layer circuit boards with high precision, as it effectively solves various manufacturing and performance issues that cannot be addressed by other methods.

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