4-Layer Ultra-Thin 0.25mm High-Density HDI PCB
As the electronic products become thinner and smaller the thickness and volume of PCB installed in these devices are smaller which promotes the gradual maturity of HDI technology resulting in ultra
HDI technology
HDI board design and manufacturing technologies
HDI (High-Density Interconnection) technology uses multilayer boards with micro-blind and buried vias, featuring micro-holes and varying process levels (1+N+1, 2+N+2, 3+N+3) to enhance signal integrity and component density.
Why opt for high-density interconnects?
High-density interconnect (HDI) boards, with their compact and efficient design, are rapidly advancing in PCB technology, offering enhanced reliability, reduced size, and cost-effectiveness for a variety of applications, including aerospace, consumer electronics, and medical devices.
Circuit Board Manufacturer in China Introduces HDI Boards
HDI technology enables denser PCB designs, facilitating smaller boards with increased component density and shorter interconnect paths, crucial for advancing multifunctional electronic products.
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HDI Tech & Application Overview
HDI circuit boards, essential for modern technology across various sectors, enable the miniaturization of electronic components, facilitating the production of smaller, more efficient devices in consumer electronics, communications, automotive, aerospace, medical, and industrial automation industries.
“PCB Production of HDI Blind Hole Boards”
The demand for high-density circuit boards drives the evolution towards High-Density Interconnect (HDI) technology by minimizing through-holes and implementing precise blind and buried vias, while considering factors like laser hole sleeving and film formatting.
Five Key Trends in PCB Technology
The PCB industry plays a critical role in meeting the demands of high-end electronic equipment through advancements in technology such as HDI, optoelectronics, component embedding, updated manufacturing processes, introduction of advanced equipment, and enhancements in materials development.
New UV laser processing technology for PCB and substrates
New UV laser technology offers superior processing capabilities for PCB boards and substrates, including precise drilling, solder mask ablation, and direct drawing with minimal steps and improved quality outcomes, positioning it as a valuable tool for the modern PCB production industry.
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